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Bibliographic Details
Previous Title:IEEE Multi-Chip Module Conference. Proceedings
Corporate Authors: IEEE Symposium on IC/Package Design Integration, IEEE Computer Society, IEEE Circuits and Systems Society, Components, Packaging & Manufacturing Technology Society, IEEE Solid-State Circuits Society
Format: Conference Proceeding
Language:English
Published: Los Alamitos, Calif. : IEEE Computer Society Press, [1998-]
Subjects:
Electronic packaging > Congresses.
Integrated circuits > Design and construction > Congresses.
Multichip modules (Microelectronics) > Congresses.
Microelectronic packaging > Congresses.
Electronic packaging.
Integrated circuits > Design and construction.
Integrated circuits.
Multichip modules (Microelectronics)
Microelectronic packaging.
Conference papers and proceedings.
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Proceedings
Published 2005
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ITHERM
Published 1998
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Proceedings
Published 1998
Connect to Design, Automation, and Test in Europe Conference
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Proceedings
Published 1997
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SC ... conference proceedings
Published 1997
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Proceedings.
Published 1995
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Proceedings of the ... IEEE International Symposium on High Performance Distributed Computing
Published 1994
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Published 1993
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DCC ... : Data Compression Conference.
Published 1991
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Published 1991
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Proceedings
Published 1991
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Published 1990
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The annual AI Systems in Government Conference : proceedings.
Published 1989
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Published 1989
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